Parameter Reference
Ranges, defaults, and meaning for every EasyTrace5000 parameter
Parameters are grouped by the stage in which they appear. The same text shows in the app as a tooltip - hover the ? icon beside any field. See the Operation Reference for which parameters matter to each operation.
Geometry Stage
Set before Generate Offsets. These define the cut geometry.
| Parameter | Range | Default | Applies to | Description |
|---|---|---|---|---|
| Tool Diameter | 0.01–10 mm | - | all | The physical diameter of the cutting tool - the most critical value for accurate offsets. |
| Number of Passes | 1–30 | 3 | isolation | Offset passes to create. More passes clear more copper but take longer. |
| Step Over | 10–99 % | 50 | isolation, clearing | Percentage of tool diameter overlapped each pass. 50% is a good default. |
| Combine Passes | on/off | on | isolation | Merge all passes into one geometry. Simpler G-code, loses per-pass control. |
| Mill Holes | on/off | on | drill | Mill circular paths inside holes larger than the tool; otherwise peck/drill at center. |
| Mill Stepover | 10–90 % | 50 | drill | Overlap on each concentric ring inside oversize holes (when Mill Holes is on). |
| Cut Side | outside / inside / on | outside | cutout | Where the tool sits relative to the outline. Outside clears around the shape, inside within, on centers the tool. |
Strategy Stage
Set before Generate Preview. These define depth and motion.
| Parameter | Range | Default | Applies to | Description |
|---|---|---|---|---|
| Cut Depth | -10–0 mm | -0.1 | all | Final target depth relative to the surface (Z=0). Negative value. |
| Multi-depth Cutting | on/off | on | all | Multiple passes at increasing depth for deep cuts. Reduces tool stress. |
| Depth per Pass | 0.001–5 mm | 0.1 | all (multi-depth) | Incremental depth of each pass. Smaller is gentler on the tool. |
| Entry Type | plunge / helix | plunge | all | How the tool enters material. Plunge: straight down. Helix: spiral down. |
| Canned Cycle | none / G81 / G82 / G83 / G73 | none | drill | Pre-programmed drill cycle. G83 peck-drilling retracts to clear chips. |
| Peck Depth | 0–5 mm | 0 | drill | Depth to drill before retracting in peck drilling. Smaller = cleaner holes. |
| Dwell Time | 0–10 s | 0 | drill | Pause at hole bottom. Clears chips and reduces burrs. |
| Retract Height | 0–10 mm | 0.5 | drill | Height between holes. Clears the board while minimizing travel. |
| Number of Tabs | 0–12 | 0 | cutout | Small uncut bridges that hold the board in place. |
| Tab Width | 0.5–10 mm | 0 | cutout | Length of each holding tab. |
| Tab Height | 0.1–5 mm | 0 | cutout | Tab thickness from the cut floor (−0.5 on a −1.8 cut leaves a 0.5 mm tab). |
Machine - Feeds & Speeds
| Parameter | Range | Description |
|---|---|---|
| Feed Rate | 1–5000 mm/min | Speed while cutting. |
| Plunge Rate | 1–2000 mm/min | Speed descending into material. Usually slower than feed rate. |
| Spindle Speed | 100–30000 RPM | Spindle rotation. Higher speeds for smaller tools. |
| Spindle Dwell | 0–60 s | Wait for the spindle to reach speed. Essential for high-inertia spindles. |
Stencil
| Parameter | Range | Default | Description |
|---|---|---|---|
| Aperture Offset | -1–1 mm | -0.05 | Shrinks (−) or expands (+) apertures. −0.05 mm prevents solder bridging. |
| Ignore Solid Regions | on/off | on | Ignore pours and traces; generate apertures only for component pads. |
| Exclude Pads Over Drill Holes | on/off | on | Remove apertures over through-holes so paste won't fall in. |
| Add Registration Holes | on/off | off | Four alignment holes outside the board for pinning the stencil. |
| Registration Hole Diameter | 0.5–10 mm | 3.0 | Diameter of the alignment pins/dowels. |
| Registration Hole Margin | 1–25 mm | 5.0 | Distance outside the board boundary to place the holes. |
Laser Pipeline Beta
Laser geometry parameters. The spot size is read-only here - set it in Machine Settings.
| Parameter | Range | Default | Description |
|---|---|---|---|
| Isolation Width | 0.05–2.5 mm | 0.3 | Total width of copper to ablate around traces. Pass count is derived from this, the spot size, and step-over. |
| Clearing Strategy | offset / filled / hatch | offset | How areas are filled. Offset is most streak-proof; filled hands the fill to your laser software; hatch is directional line coverage. |
| Step Over | 10–99 % | 50 | Overlap between adjacent laser paths. Lower (more overlap) removes copper better; reduce to ~30% if streaks appear. |
| Hatch Base Angle | 0–180° | 45 | Angle of hatch lines; cross-hatch adds a perpendicular set. 45° crosses both H and V traces. |
| Cut Side | outside / inside / on | outside | Where the kerf falls relative to the outline (board stays full size / shrinks / shrinks by half-kerf). |