EasyTrace5000

Operation Reference

What each EasyTrace5000 operation does, and when to reach for it

Overview

Each operation is its own bucket in the operations tree. You add source files directly to an operation, set its parameters, and generate geometry. Operations are independent and non-destructive - generating one never alters another. Every parameter named below is documented in full on the Parameter Reference.

Operations run in two stages: Geometry (offsets, drill strategy, apertures) via Generate Offsets, then Strategy (depth, feeds, entries) via Generate Preview. The Laser pipeline produces fills in a single geometry stage and skips Preview.

Isolation Routing Stable

Cuts a clearance channel around copper so traces and pads become electrically isolated. It generates external offsets around copper geometry; multiple passes widen the cleared band outward from the trace edge.

Use it for: the primary copper-separation pass on any single-layer board.

Key parameters: tool diameter, number of passes, step-over, combine passes. More passes clear more copper between traces but take longer. Isolation can contain thousands of primitives, so only compound contours are resolved (not full inter-primitive merging) to keep generation fast.

Drilling Stable

Handles holes from Excellon files or SVG circles/obrounds. The handler measures each hole against the tool diameter and chooses a strategy automatically: a peck/plunge drill when the tool matches the hole, or a circular milling path when the hole is larger than the tool (enable Mill Holes).

Use it for: through-holes, vias, and slotted mounting holes.

Key parameters: mill holes + mill step-over (for oversize holes); canned cycle (G81/G82/G83/G73), peck depth, dwell time, retract height, and entry type for the drilling pass.

Copper Clearing Stable

Removes large copper areas (ground pours, fills) rather than just isolating them. It generates always-internal offsets that collapse inward until the region is cleared. Nested topology is resolved first - shapes inside shapes become holes - so inner islands aren't mistaken for "tool too large" errors.

Use it for: clearing copper where isolation alone would leave too much conductive material (e.g. RF grounds, exposed pours).

Key parameters: tool diameter and step-over. Clearing intentionally collapses geometry to nothing, so the small-circle guard is disabled for this operation.

Board Cutout Stable

Cuts the board free from the stock along its outline. Supports cut side (outside / inside / on-line) and holding tabs that leave small uncut bridges so the board doesn't shift on the final pass. Closure detection extracts closed loops from multi-segment outlines and prompts you to close any orphan gaps.

Use it for: the final perimeter cut and any internal cut-outs (windows, large slots).

Key parameters: cut side; number of tabs, tab width, tab height. Tab height is measured from the cut floor - a -0.5 mm tab on a -1.8 mm cut leaves a 0.5 mm bridge.

Solder Stencil New

Generates solder-paste stencil apertures from pad geometry. Unlike the other operations it doesn't use the offset milling pipeline - it filters source geometry down to pads, optionally shrinks or expands each aperture, and outputs a clean layer ready to laser- or vinyl-cut.

Use it for: producing a paste stencil for SMD assembly.

Key parameters: aperture offset (a small negative value such as -0.05 mm prevents bridging); ignore solid regions (pads only); exclude pads over drill holes; and optional registration holes (diameter + margin) for alignment.

Stencil output is a 2D layer - open the Export Manager and export SVG (or PNG) for your laser/vinyl software. It does not produce milling G-code.