Overview

The Laser pipeline generates vector and raster output files from your PCB design files. Unlike the CNC pipeline which outputs G-code for mechanical milling, the Laser pipeline exports SVG, DXF, and PNG files optimized for use with laser control software.

The workflow mirrors the CNC pipeline: load files, configure operations, generate geometry, and export. What your laser can do with that output—copper ablation, photoresist exposure, stencil cutting, etc.—depends on your equipment and materials.

Common Applications

• Direct Ablation: Fiber lasers vaporizing copper isolation zones
• Stencil Cutting: CO₂ or fiber lasers cutting paste stencils from Kapton/Mylar
• Soldermask Cutouts: Cutting pad openings in soldermask film
• Board Outlines: Scoring or cutting FR4 (with appropriate laser)

The Workflow

The Laser workflow follows similar stages as CNC, but exports different file formats. If you're familiar with the CNC Guide, you'll recognize the process.

Loading Files

Load your PCB files the same way as the CNC pipeline: drag-and-drop, file modal, or category add buttons. The Laser pipeline accepts the same file types:

• Gerber: Copper layers, soldermask, paste layers
• Excellon: Drill files for hole positions
• SVG: Custom outlines or artwork

For stencil generation, you'll load paste layer Gerbers (.gtp, .gbp). For soldermask work, load soldermask files (.gts, .gbs).

Generating Geometry

Select an operation from the tree and configure parameters. The Laser pipeline uses similar controls to CNC:

Kerf / Line Width

Width of the laser cut. Used to calculate offsets and preview visualization.

Passes

For isolation, number of offset passes to create wider isolation zones.

Hatch Settings

For filled areas: hatch spacing, angle, and pattern (line, crosshatch).

Click Generate Geometry to create the laser paths. Preview shows the geometry that will be exported.

Exporting

Once geometry is generated, export via Actions → Export or the Properties panel. Choose your format based on your laser software:

• SVG: LightBurn, Inkscape, LaserGRBL
• DXF: EzCad, RDWorks, industrial systems
• PNG: Direct exposure systems, raster engraving

Operation Types

The same operation categories apply, but output differs from CNC. Instead of G-code toolpaths, you get vector or raster geometry optimized for laser processing.

Isolation

Generates geometry for the isolation zones around traces. Output depends on your workflow:

Output Modes

Vector Outlines

Stroke paths along isolation boundaries. For scoring or single-line work.

Hatched Fill

Fills isolation zones with parallel lines at configurable spacing and angle. For ablation workflows where you need to remove material.

Parameters

Kerf Width

Your laser's effective cut width. Determines offset calculation.

Passes

Number of offset passes for wider isolation.

Hatch Spacing (for hatched fill)

Distance between hatch lines. Smaller = more complete material removal.

Hatch Angle

Angle of hatch pattern. 45° is common; use crosshatch (0°+90°) for thorough coverage.

Drilling

For fiber lasers capable of drilling through copper and substrate, generates spiral or trepanning paths. For other workflows, exports hole positions as markers for mechanical drilling or reference points.

Output Options

Center Points

Simple markers at hole centers. Use as alignment/reference.

Circles

Circle outlines at hole diameter. For scoring or light engraving.

Spiral/Trepan Paths

For laser drilling: spiral from center outward, or trepanning around perimeter.

Board Cutout

Generates board outline paths for cutting or scoring. Same offset options as CNC (outside, inside, on-line).

Stencil Generation

New operation type for the Laser pipeline. Load paste layer Gerber files to generate solder paste stencil apertures.

Parameters

Aperture Reduction

Percentage to shrink apertures (0-10% typical). Prevents excess solder paste.

Corner Radius

Round sharp corners to prevent paste bridging. 0.05-0.1mm typical.

Minimum Aperture

Skip apertures below this size. Prevents cutting features too small for your laser.

Frame/Fiducials

Add alignment frame or preserve fiducial markers for registration.

Soldermask Clearing

For boards with existing soldermask or conformal coating, generates geometry to ablate the mask from pad areas, exposing copper for soldering or rework. Uses soldermask Gerber files to identify pad locations.

Parameters

Pad Expansion

Increase clearing area beyond pad edges. Ensures complete mask removal.

Output Mode

Vector outlines for scoring, hatched fill for complete ablation.

Export Formats

SVG Export Options

Stroke Width

Set to match laser kerf for accurate visual preview in your software.

Layer Separation

Separate operations into SVG groups. Assign different power/speed per layer.

Color Coding

Assign colors to layers. Many laser programs use color for settings lookup.

Optimize Paths

Reorder paths to minimize travel. Reduces job time.

Use Cases

Fiber Laser Ablation

Use hatched fill isolation output. Import SVG into EzCad or LightBurn. Configure power/speed for copper removal (material-dependent, typically 80-100% power, 100-300mm/s, multiple passes). Drill holes with spiral paths or mark for mechanical drilling

Solder Paste Stencils

Load paste layer, use Stencil operation. Export SVG/DXF. Cut from 0.1-0.15mm Kapton or Mylar on CO₂ or fiber laser. Align using fiducials or frame corners.

Hybrid Workflow

Combine laser and CNC: use laser for fine isolation traces (better resolution), CNC for drilling and cutout (faster, safer for FR4). Export both formats with matching coordinates and fiducial markers.

Experimental Features

Direct Solder Reflow

Research

Fiber lasers can reflow solder paste directly, heating each pad to melting point without an oven. We're exploring scan pattern generation from paste Gerbers. Requires precise power modulation and potentially temperature feedback.